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You can read more information on our terms and conditions, please click here. By clicking on "OK" you confirm that you have read and understood our legal terms and conditions.1. Field of the Invention
The present invention relates to a wiring board and a manufacturing method thereof. More particularly, the present invention relates to a wiring board, which comprises a base member that has an insulating substrate and a circuit board on the substrate, and a conductive circuit pattern provided on the surface of the base member, and a manufacturing method of the wiring board.
2. Description of the Related Art
A wiring board used for an electronic device such as a cellular phone, or the like, is subjected to various processing such as hole formation, through hole formation, plating, and the like. Among these processing, an electrolytic plating process, in which a conductive circuit pattern is formed by plating on the surface of the base member with use of the conductive circuit pattern as a cathode, is widely used. Since the electrolytic plating process is a wet processing, it is necessary to seal the base member so that the base member is not exposed to the atmosphere.
FIG. 1 shows a conventional wiring board 100. In FIG. 1, the wiring board 100 comprises a base member 101 having an insulating substrate 102, and a conductive circuit pattern 103 formed on the surface of the base member 101. On the surface of the insulating substrate 102, a protection film 104 is formed. The wiring board 100 is covered with an insulating cover member 105. The wiring board 100 is housed in a housing member 106, and hermetically sealed with the cover member 105 by an O-ring 107.
In the above-mentioned wiring board 100, however, the O-ring 107 is used for hermetically sealing, thereby increasing the number of parts and requiring additional processing. Further, after the 0b46394aab